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Technology & Software  Click here to view list of papers
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This sector provides information and resources on Technology & Software through white papers, case studies, information resources and a virtual exhibition of companies dealing in products solutions and services.

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Labthink Instruments.Co., Ltd.Standard of Coulometric Film Oxygen Permeability Testing
Author:Labthink Instruments.Co., Ltd.
Company:Labthink Instruments.Co., Ltd.


E²M/PolytronOptimizing a Manufacturing Line Using Automod with an Excel Interface
Author:Christiana l. Zhookoff
Company:E²M/Polytron


Intralox, L.L.C.Producing Rainbow and Mixed Pallets: Options and Solutions
Author:Rachel Stolier
Company:Intralox, L.L.C.


HIBCCNext Generation Bar Codes for Small Package Labeling
Author:HIBCC
Company:HIBCC


Tompkins AssociatesControl Systems Evolution in Pharmaceutical Packaging
Author:Ralph Cox
Company:Tompkins Associates


ACISS Holding BV,  NetherlandsSafe & Secure Air Cargo Containers with Integrated RFID Visibility System
Author:Henk G. Hilders
Company:ACISS Holding BV, Netherlands


Dynasys Technologies, Inc.Basic Guide To Smart Label Terminology
Author:Bob Scher
Company:Dynasys Technologies, Inc.


Tata Consultancy ServicesEnabling Traceability – RFID
Author:T S Rangarajan
Company:Tata Consultancy Services


Packaging Technologies and InspectionPackage Testing
Author:Tony Stauffer
Company:Packaging Technologies and Inspection


Tetra PakHow Packaging can enable Growth and Innovation in the Foodservice Channel.
Author:Andrew Dun
Company:Tetra Pak


Triangle Package Machinery Co.How to Increase Flexibility and Control Costs: New Technology Challenges the Traditional Packaging Line Concept
Author:Triangle Package Machinery Co.
Company:Triangle Package Machinery Co.


Dynasys Technologies, Inc.ISO 15693 and What It Means for You
Author:Bob Scher
Company:Dynasys Technologies, Inc.


PCM Image-TekHula Girl Rides Flying Printer Applicator, Customized For the US Postal Service
Author:Michael H. Holland
Company:PCM Image-Tek


PCM Image-TekCustom Package Labeling System for US Postal Service Bulk Mail Hubs
Author:Michael H. Holland
Company:PCM Image-Tek


LakeWest Group, LLCRFID in Retail: The Future is Now
Author:Robert Antall
Company:LakeWest Group, LLC


Labthink Instruments.Co., LtdApplication Fields for CHY-C1 Thickness Tester Become Broader
Author:Labthink Instruments.Co., Ltd
Company:Labthink Instruments.Co., Ltd


PTCAn Introduction to Structured Product Labeling
Author:PTC
Company:PTC


WPO-World Packaging Organisation and STFI-PackforsFrom Push to Pull - Emerging New Structures in the Packaging Sector to Meet Future Demands
Author:Dr Carl Olsmats
Company:WPO-World Packaging Organisation and STFI-Packfors


Intralox, L.L.C.New Technology Affordably Increases Packaging Line Throughput
Author:Rachel Stolier
Company:Intralox, L.L.C.


Chemical Accident Reconstruction Services, Inc.Computer Stress Analysis of Self-Pressurized Container Bottom
Author:Michael Fox, Ph.D., Pinghua Zhao, Ph.D. and Juan C
Company:Chemical Accident Reconstruction Services, Inc.


Rollprint Packaging ProductsAdvances in Peelable Sealant Technology
Author:Dhuanne Dodrill
Company:Rollprint Packaging Products


PCM Image-TekCustom Printer Applicators for Food Refineries
Author:Michael H. Holland
Company:PCM Image-Tek


Euro Plus d.o.o. & Niceware® International, LLCNiceLabel Software for Microsoft Windows Terminal Services and Citrix MetaFrame
Author:Euro Plus d.o.o. & Niceware® International, LLC
Company:Euro Plus d.o.o. & Niceware® International, LLC


UnisysRadio Frequency Identification: Moving Beyond the Hype to Maximum Value
Author:Unisys
Company:Unisys


IDTechEx LimitedThe Future is Full of Surprises--Massive Potential for Organic Electronics
Author:Dr. Peter Harrop
Company:IDTechEx Limited


RedPrairieRFID Technology
Author:RedPrairie
Company:RedPrairie


Dynasys Technologies, Inc.RFID Tunnel Antennas
Author:Bob Scher
Company:Dynasys Technologies, Inc.


Epoxy Technology, IncEpoxies for OptoElectronic Packaging; Applications and Material Properties
Author:Michael J. Hodgin
Company:Epoxy Technology, Inc


Enercon Industries Corp.Corona Treatment: A Process Overview
Author:Rory A. Wolf
Company:Enercon Industries Corp.


UPS Professional Services Technology and System Enhancements in the UPS Distribution Environment
Author:Chad Thompson, CPP
Company:UPS Professional Services


Labthink Instruments.Co., Ltd.The Development of China's Packaging Education
Author:Labthink Instruments.Co., Ltd.
Company:Labthink Instruments.Co., Ltd.


Speakers GoldProspecting Online in the Packaging Industry
Author:Cathleen Fillmore
Company:Speakers Gold


 Auto-ID Labs of Massachusetts Institute of TechnoPackaging and RFID: Incorporating RFID in the Real World
Author:Daniel W. Engels, Ph.D.
Company: Auto-ID Labs of Massachusetts Institute of Techno


Altair Engineering, Inc.Smart Product Packaging Pays Off
Author:Joanne Zuzelski And Beverly Beckert
Company:Altair Engineering, Inc.


Datamax CorporationAn Overview of Connectivity Technologies
Author:Datamax Corporation
Company:Datamax Corporation


TransboticsInnovative Technology and User Benefits for the Packaging Industry
Author:Brian Keiger
Company:Transbotics


E²M/PolytronAssessing the Value of Emulation
Author:Geoff Mueller
Company:E²M/Polytron


Challenging Your Assumptions Concerning Authentication
Author:R. James Assaf
Company:InkSure Technologies Inc.


E²M PolytronTraining Methodology in the Manufacturing Packaging
Author:E²M Polytron
Company:E²M Polytron


PTCAn Introduction to Product Information Management
Author:PTC
Company:PTC


NJM/CLI Packaging Systems InternationalRadio Frequency Identification
Author:William P.Delmolino
Company:NJM/CLI Packaging Systems International


Creative Marketing Impact, Inc.Cosmetic Packaging Trends
Author:Deborah J. Coles-Dobay
Company:Creative Marketing Impact, Inc.


Videojet Technologies Inc.Leveraging Coding Technology to Cut Cost While Boosting Efficiency and Improving Supply Chain Management
Author:Scott Liniger
Company:Videojet Technologies Inc.


DuPont de Nemours InternationalInnovative Packaging Approaches Using Sealant and Packaging Concepts from DuPont
Author:Dr. Karlheinz Hausmann
Company:DuPont de Nemours International


GOLD SUPPLIERS
3M Industrial Services & Solutions
ABB Inc.
AlliedFlex® Technologies, Inc.
AlliedFlex Technologies
BarCodeAmerica.com / RDG
BASF Catalysts LLC
Central States Distribution Service, Inc.
FANUC Robotics America, Inc.
HSAUSA, LLC
Imaje
InkSure Technologies, Inc.
KUKA Robotics Corp. USA
Leak Detection Associates, Inc.
Mark Andy
Merrill's Packaging, Inc.
Pack-Track
Tinius Olsen, Inc.
SILVER SUPPLIERS
Adept Technology
Cortegra
Dr. Lauterbach & Partner GmbH
Multipond America, Inc.
NUR Macroprinters, Ltd.
The Numina Group
BRONZE SUPPLIERS
Discturnkey Solution Co., Ltd.
Industry Bronze
Isra Surface Vision Inc.
Sensor Wireless Inc.

Industry IDS, Inc
Foodservice & Packaging Institute, Inc The Adhesive and Sealant Council Women in Packaging
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